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Automotive Aftermarket Manufacturing

Honeywell Announces Patent Agreement with DENSO

DENSO Corp. and DENSO International America have reached an agreement with Honeywell for the use of a Honeywell patent relating to the manufacture of pressure sensors used in automobiles. Financial terms of the agreement were not disclosed. The patented technology relates to an improved method of etching silicon wafers for the manufacture of pressure sensing integrated circuits

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MORRIS TOWNSHIP, NJ — DENSO Corp. and DENSO International America have reached an agreement with Honeywell for the use of a Honeywell patent relating to the manufacture of pressure sensors used in automobiles. Financial terms of the agreement were not disclosed.

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The patented technology relates to an improved method of etching silicon wafers for the manufacture of pressure sensing integrated circuits. In accordance with the terms of the agreement, DENSO may use Honeywell’s U.S. Patent No. 5,360,521 for the manufacture of certain of its pressure sensors.

For more information on Honeywell, go to: www.honeywell.com.

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