DENSO, a leading mobility supplier, yesterday hosted a business briefing to share its semiconductor strategy and how the company is achieving its Long-term Policy 2030. During the briefing, DENSO leaders discussed how semiconductors help lay the foundation in pursuing the company’s “Two Great Causes: Green, achieving carbon neutrality by 2035, and Peace of Mind,” creating a safe and seamless world for all.”
“Semiconductors are crucial to the automotive industry as new vehicles and mobility technologies become increasingly reliant on them to unlock new capabilities, especially in electrification and autonomous driving areas,” said Yoshifumi Kato, senior executive officer and chief technology officer of DENSO Corp. “It’s important we make the most of existing semiconductor supplies, while also creating our own rugged chips to meet growing demand. At DENSO, we have divided semiconductor activities into three areas, each with its own strategy for stable procurement and development.”
Securing a stable procurement network is most important for microcomputers and SoCs, where the division of labor in specification, design and manufacturing is progressing and miniaturization is necessary. DENSO will work to strategically present specifications from an in-vehicle perspective, promote standardization, secure multiple production bases, and reform its procurement structure. By 2025, DENSO intends to standardize microcomputers, close the gap between the automotive and semiconductor industries, and make the supply chain more robust.
DENSO has been producing high-voltage power and analog semiconductors for about half a century, endeavoring to develop rugged semiconductors. In high-voltage power semiconductors, DENSO is working to produce large-diameter silicon wafers with strategic partners and to fully launch silicon carbide wafers, which will contribute to improving the electric cost for battery-electric vehicles (BEVs). In analog semiconductors, the company will accelerate the development of rugged semiconductors that can withstand the performance of in-vehicle environments and application-specific integrated circuits (ASIC) that thoroughly meet its customers’ needs. By 2025, DENSO aims to achieve sales equivalent to 500 billion yen as in-house manufactured semiconductors.
Through collaboration with strategic partners, DENSO says it will apply technologies in the non-vehicle domain to the automotive domain. The company will accelerate collaboration with strategic partners by anticipating rapidly changing technology trends and communicating in-vehicle trends to strategic partners. The company says it also will work to further strengthen its semiconductor planning capabilities, which will be necessary for future mobility, and our technological capabilities to maximize sensor performance. DENSO is aiming to develop compact, high-performance environmental recognition sensors with advanced driver assistance functions of Level 3 or higher by 2025.
